Place of Origin:
China
Nama merek:
WENYOU
Sertifikasi:
REACH/RoHS/UL/SGS/IOS
Model Number:
LE-9516/LH-9516
Dokumen:
Attribute | Value |
---|---|
Viscosity | 200-500 |
Process | APG & Vacuum Casting |
Thermal Decomposition | >320°C |
Adhesion Strength | Strong |
Usage | Electrical insulation |
Component | Product Code | Ratio |
---|---|---|
Epoxy resin | LE-9516 | 100pbw |
Hardener | LH-9516 | 100pbw |
Filler | Silica | 350-400pbw |
Color paste | LC- | 3pbw |
A two component saturated epoxy resin system without premixed filler, liquid at room temperature. It is suitable for both APG injection process and vacuum casting process.
Resin LE-9516 Properties | Hardener LH-9516 Properties | ||||
---|---|---|---|---|---|
Property | Unit | Standard | Property | Unit | Standard |
Appearance | Visual | Transparent-yellow liquid | Appearance | Visual | Transparent-yellow liquid |
Epoxy value | Eq/kg | 4.0-4.5 | Viscosity at 25℃ | mPa.s | 150-400 |
Viscosity at 25℃ | mPa.s | 500-1500 | Density at 25℃ | g/cm3 | 1.17-1.24 |
Density at 25℃ | g/cm3 | 1.16-1.20 | VP | Pa | About 0.5 |
VP at 25℃ | Pa | <0.01 | Flash point | ℃ | About 140 |
Flash point | ℃ | About 135 |
Processing parameters | Automatic Pressure Gelation | Vacuum casting |
---|---|---|
Epoxy Resin/Hardener mixing temperature | 40℃/1-2h | 50-60℃/1-1.5h |
Feeding method | Pressure(0.5-5bar) | Vacuum (casting pot) |
Mold temperature | 130-150℃ | 105℃/4-6h |
Gelation time | 10-50mins | 80℃/4h+100℃/2h+120℃/2h |
Post-curing | 130-140℃×6-10h | 130-140℃×6-10h |
Temperature | Gel time |
---|---|
at 120℃ | 20-40mins |
at 140℃ | 9-18mins |
at 160℃ | 4-8mins |
Test system: Resin LE-9516 / curing agent LH-9516 / silica flour=100/100/400 Curing conditions: 120°C × 4hours +140°C × 8hours
Note: The following performance data are measured according to the national standard and are for user reference only. The specific application data should be determined according to the actual conditions of the user.
Properties | Typical results | Properties | Typical results |
---|---|---|---|
Tg(DSC) | 60-80℃ | Thermal decomposition temperature | >320℃ |
Tensile strength | 60-80N/mm2 | Water absorption rate (23°C × 10 days) | 0.10-0.20 %by wt. |
Flexural strength | 100-130N/mm2 | Water absorption rate (100°C × 60 minutes) | 0.08-0.15 %by wt. |
Compressive strength | 140-190N/mm2 | Surface resistivity | 1014 Ω |
Impact strength | 8-16kJ/m2 | Volume resistivity | 1015 Ω.cm |
Curing shrinkage | 0.8-1.0% | Dielectric strength | 31 kv/mm |
Flame resistance (4mm) | HB level | Dielectric loss | 0.02 |
Thermal conductivity | 0.8-0.9W/mk |
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